LakeSemi focuses on seven application areas — home appliances, servo drives, industrial power supplies, server power, compressor drives, automotive electronics and 140W PD3.1 fast charging. Each area comes with QST GaN chip selection support and a complete application block diagram to help you quickly lock in the right power device combination.
From consumer fast chargers to AI server power — QST GaN and companion controllers cover the full power spectrum. Click a chip tag to jump to its product page.
Power boards and motor drives for inverter air conditioners, refrigerators and washing machines. Smart IPM modules make appliances quieter, greener and longer-lived.
Industrial servo drive power stages. 650V GaN HEMT high-frequency switching delivers smaller drives, faster response and more precise positioning.
Industrial switching and auxiliary power supplies. Wide-input PFC + QR flyback topology with a complete LakeSemi chip chain.
Full-stack GaN solution for the AI compute HVDC 800V architecture — four power nodes from the SST front end to GPU vertical power (deep dive below).
Variable-frequency drives for commercial refrigeration and air-conditioning compressors. Integrated IPM solutions simplify the power board and cut system cost.
On-board chargers (OBC), DC-DC converters and 48V mild-hybrid systems. AEC-Q qualification in progress, co-developing with OEMs.
USB PD3.1 28V/5A fast-charging power supplies. The single-chip LGMA combo QR flyback design takes adapters past the 94% efficiency barrier with ease.
For the Nvidia HVDC 800V server power architecture, LakeSemi delivers a full-stack GaN solution — from AC mains to GPU vertical power across four power nodes. An integrated "digital MCU + GaN power stage" approach distinguishes it from conventional analog designs, powering next-generation GPU data centers.
Solid-State Transformer (SST) topology for the AC/DC front end and high-voltage isolation, built on 1800V QST GaN HEMTs with multilevel bidirectional conversion. A long-term flagship node targeting next-generation MW-class server racks and DC microgrids.
LLC resonant and phase-shifted full-bridge topologies. 1200V QST GaN HEMTs support kW-class high-density isolated conversion. This is LakeSemi's main delivery direction today — the cash-cow node of the solution, aimed at data center PSU main power stages.
Digital-controlled multiphase Buck intermediate bus conversion modules with PMBus / I2C monitoring, adaptive current sharing and fault diagnosis, feeding the 12V server motherboard rail. The digital smart modules are already in volume production.
SiPPM digital power module arrays mounted vertically directly beneath the GPU package. Multiphase Buck with dual-sided cooling; the "digital MCU + GaN power stage" integrated package brings programmable, monitorable and adaptive control to kilowatt-class AI GPUs.
| Power Node | Function | Recommended Parts | Status |
|---|---|---|---|
| ① SST HV Module | AC/DC front end + HV isolation | 1800V QST GaN HEMT | In development |
| ② 800V/48V | LLC / PSFB isolated conversion | 1200V QST GaN HEMT | Main delivery |
| ③ 48V/12V | Digital intermediate bus conversion | Digital smart module (in production) | In production |
| ④ GPU VPD | Vertical power module array | SiPPM digital power module | Unique in China |
| Support layer | PFC control | LS2806 / LS2806A Active PFC Controller | In production |
| Synchronous rectification | LS8060 Sync Rectifier Controller | In production | |
| Power switch | LGaDC65R 650V GaN HEMT Series | In production |
Every application area has a matching production-ready power solution — complete BOM, schematic, EMC data and Demo Board delivered together, ready to go straight to production.
