LakeSemi is founded by senior engineers from STMicroelectronics and Texas Instruments. We deliver best-in-class intelligent power-supply and motor-drive solutions built on our 8" QST GaN process platform, pushing the efficiency and power-density envelope across industrial, energy, automotive, appliance and AI-compute markets.
LakeSemi was founded by veterans of STMicroelectronics and Texas Instruments to deliver industry-leading intelligent power and motor-drive solutions. We help customers tackle the toughest challenges and bring greater safety, sustainability and efficiency to end products across industrial, energy, automotive and home-appliance markets.
Headquartered in the Hefei National High-Tech Zone and incubated by the municipal High-Tech Investment Fund, LakeSemi is a National High-Tech Enterprise — and the world's first chip design house to mass-produce GaN-on-substrate (QST) chips on 8" wafers, and the only one with 1200V QST GaN in volume production. We deliver turn-key solutions tailored to market demand, creating innovative value for our industrial customers.
Starting from the Hefei Hi-Tech Zone, LakeSemi has been breaking new ground on the QST GaN process — every milestone a new coordinate for China's power-semiconductor industry.
Founded by veterans from STMicroelectronics and Texas Instruments, headquartered in the Hefei Hi-Tech Industrial Park, with QST GaN as our core platform.
Co-qualified the world's first 8" GaN-on-substrate (QST) process platform with foundry partners, becoming the first chip design house to mass-produce 8" QST GaN.
Officially designated a National High-Tech Enterprise. R&D investment ramped; 650V GaN HEMTs and the LGMA-series QR-flyback combo IC ramped into the power-supply mainstream.
The industry's only 1200V QST GaN product officially launched — targeting AI compute and EV — while our Gen-3 power-semi capabilities on the 8" QST platform keep advancing.
Strategy shifts from selling devices to selling platforms and solutions — with a new Shenzhen sales office, QST GaN now lands in AI server power, 2.45GHz RF PA modules and industrial ultrasonic-welding drives simultaneously.
Built on the QST GaN platform, LakeSemi delivers full-stack silicon-to-system solutions across six verticals.
Variable-frequency AC, refrigerator and washing-machine power. IPMs and GaN HEMTs make the whole unit quieter, more efficient and longer-lasting.
Industrial inverters, servo drives and ultrasonic-welding supplies. Gate drivers plus GaN HEMTs enable high-frequency, high-density solutions.
On-board chargers (OBC), DC-DC, 48V mild-hybrid and traction drives. AEC-Q qualification in progress; co-development with OEMs.
1200V QST GaN AI-server power-supply solutions and HVDC-800V architecture research, targeting next-generation GPU data centers.
PV inverters, energy-storage PCS and UPS. SiC hybrid modules plus GaN drive 99%-efficient power-conversion links.
QST GaN in 2.45GHz RF PA modules — covering microwave heating, 5G small cells and mobile RF front ends.
LGMA QR-flyback combo IC plus synchronous rectification — pushing 65-200W adapters past 94% efficiency with ease.
From silicon to reference designs, EMC remediation to mass-production support — delivering complete solutions shaped by real market needs.
Hefei HQ plus a Shenzhen sales center — keeping response time short across all of China.
We're gearing up for the next chapter — from chips to full solutions. If you share the mission of reshaping power-semi with QST GaN, LakeSemi is where you belong.
Digital circuit design, simulation, verification and tape-out follow-up for PFC / QR / SR controllers and combo ICs. Digital IC and analog-mixed-signal backgrounds welcome.
Device architecture design, process development and yield improvement for QST GaN HEMTs, SiC and super-junction MOSFETs — working hand-in-hand with foundry partners.
Reference designs and turn-key solutions built on LakeSemi GaN / IGBT / MOSFET products, plus customer support; EMC remediation and reliability validation.
Develop and grow industrial / consumer / automotive / AI-compute accounts — from requirements to solutions, owning your quota.
Embedded at customer lines and labs — PCB layout, thermal design, EMC remediation and reliability troubleshooting on site. Power-electronics background preferred.
Process integration, mass-production bring-up and yield improvement for QST GaN at external foundries. Power-device process-integration experience preferred.
Competitive base salary plus employee stock incentives. Open positions across Hefei / Shenzhen.
